SPI-6500 is a semi-automatic 3D solder paste thickness tester, which needs to manually move the platform and automatically scan the axis to scan the solder paste to obtain the 3D data of each point.

It can also be used to measure the average thickness of the solder paste of the whole pad, so that the printing process of solder paste can be well controlled.

1. Adopting the original German imported high-definition color camera to ensure the high precision and stability of the test.
2. Using micro-power consumption level of the secondary laser, by the external environment of the light source interference is small, plus the stability of the long life.
3. The use of flexible hardware design, light source, laser and camera, can be tested on different colors of PCB board.
4. Software analysis conditions based on the database, according to the analysis conditions to achieve early warning function, intuitive and easy to understand.
5. Powerful report analysis function, automatic generation of R-Chart, X-Bar, automatic calculation of CPK.
6. Export detailed and complete SPC reports, completely avoiding the various drawbacks of handwritten reports.
7. The software adopts simple and practical concepts, focusing on the high precision design of the test, correction block repeatability of plus or minus 0.001mm.

 Measured Data including the thickness, Area Coverage, volume percentage of solder paste.

 Can measure a number of areas。

 Measuring Method：Semi-automatic, automatic scanning tin paste.

 3D Simulation of tin paste, reproducing the true shape of tin paste.

 Adopting Single-Axis Automatic Scanning Movement.

 High-Speed and High-Resolution Camera, high precision，powerful SPC data statistical

analysis.

 6 SIGMA Automatic discrimination function.

 Automatically generate CP、CPK、X-BAR、R-CHART、SIGMA Bar Chart,trend Chart,control

Chart etc.

 Print 3D Report。

 Assistant 2D Measurement,distance between two point, area size etc.

 The list of survey results will be saved automatically, and generate SPC Report.