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During the mounting process, the suction nozzle is particularly susceptible to solder paste and dirt. If the nozzle is not maintained for a long time, or if the nozzle is not thoroughly cleaned during maintenance, the solder paste and dirt will harden, making it more difficult to clean, and even leading to clogging after a long period of time, resulting in scrapping.
| Size | 540 x 570 x 530 mm |
|---|---|
| Weight | 62KG |
| Nozzle Size | 0201 ~ 2125 |
| Voltage | AC110V/ AC220V |
| Pallet | 32 Position |
Due to the chip mounting, adsorption nozzle stained with solder flux and so on, resulting in frequent failures, bringing a great impact on production, has become an urgent need to solve the problem.
Automatic nozzle cleaning device, using pulse cleaning, can be in a short period of time to the inner wall of the nozzle, previously impossible to remove the dirt removed, the use of non-toxic and harmless industrial pure water (PH value of 5-7 soft water), in the removal of the nozzle will not be damaged, and is beneficial to the green environment.
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